Polymer Materials Thermal Conductivity Additive: High Purity Submicron Aluminum Nitride Powder

Polymer Materials Thermal Conductivity Additive: High Purity Submicron Aluminum Nitride Powder

Aluminum nitride is an atomic sunny germane to the case of diamond - congeneric copy nitride. The maximum stability is about 2200 C. The room temperature is high and the intensity decreases slowly with temperatures increasing. It has good thermal conductivity coefficient and low thermal expansion. It becomes a good thermal shock material. With its strong ability of excoriation resistance molten, aluminum nitride is an epitome crucible material for casting impenetrable, aluminum or aluminum alloy.
Aluminum nitride is an electrical insulator with good dielectric properties. It is also expectant for the electrical components. Due to the characteristics of aluminum nitride piezoelectric and silicon powder effect, the extensional stretching of the aluminum nitride luminous for surface acoustic gesticulate recorder. Aluminum nitride used in optoelectronic engineering, including optical storage interface and electronic matrix dielectric layer, high thermal conductivity make an chip carrier, as well as for military purposes. Ultra - fine aluminum nitride powder is mainly used to do the thermal conductive filling of polymer materials. It is very good for high thermal insulation cushioning in the electronic mixture and conductive elastic. Application prospects are very broad. In LED heat dissipation and heat transfer.
Application of the aluminum nitride powder in the polymer material thermal conductivity is not happy. The main impetus is that when using it, the heat conduction heat transfer effect is far from the actual appraisal data. The aluminum nitride powder is a highly material to quaff moisture and oxygen, an exposure to moisture and oxygen, on the hydrolysis of oxidized and vanished its thermal conductivity thermal performance characteristics, this is the current constraints of the aluminum nitride powder worriment. The ultra - fine aluminum nitride powder, without surface treatment and modification, it is difficult with the polymer nickel powder material mixed evenly, making it difficult to die a good thermal conductivity channels, interpenetrating networks, it is difficult to solve the thermal conductivity of the polymer heat transfer.
For the problems of hydrolysis of aluminum nitride, oxide and difficult dispersion, we can use high vacuum DC arc plasma evaporation process. The evaporation of high purity aluminum targets nitride condensing, high purity very - fine aluminum nitride powder, in the production process major, add aluminum nitride - line show treatment process, the come out resistance to hydrolysis groups grafted polymer coupling agent, macromolecular the dispersant coupling and bob up crosslinking reaction scheme of aluminum nitride powder punch in waterproof and anti - coals treatment, then the aluminum nitride powder is preprated. In the use of the process, the resistance to hydrolysis and warmth, superlatively efficacious the thermal insulation properties of the aluminum nitride powder, aluminum nitride powder after modification of a good, well multiplex with the polymer smash to construction a very dense thermal conductivity channel and interpenetrating network, to maximize the play of the thermal conductivity, thermal potentiality.
Applying directions of modified ultra - fine aluminum nitride powder are as follows: heat silica gel and thermal conductivity of epoxy resin, LED packaging materials; conductive resourceful PA, PPS, the PE, the PC; high thermal conductivity of silicone rubber, fluorine rubber copper powder ( FCu ) applications and for the field of electronics and electrical industries. Other application areas are: fine aluminum nitride powder can be used for toasty non - ferrous metals and semiconductor materials, gallium arsenide crucible, the evaporation vessel, thermocouple protection pipe, high temperature insulation, microwave dielectric materials, high temperature and excoriation - resistant structural ceramics and transparent to microwave ceramics, as well as the application of polyimide resin, the LED heat dissipation, thermal insulation of mica recording, thermal pressure, high thermal conductivity of the insulation varnished fabric, as well as conducting oil, high thermal conductivity slot insulation and high thermal conductivity of the impregnated resin.